Composite board with semiconductor chips and plastic housing...

Details Composite board with semiconductor chips and plastic housing... Composite board with semiconductor chips and plastic housing...

2007-02-28

2010-06-08

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

C438S122000, C425S089000, C264S338000, C264S272170, C257SE23001

Reexamination Certificate

active

07732242

ABSTRACT:
One aspect is a composite board including semiconductor chips in semiconductor device positions and a plastic housing composition partly embedding the semiconductor chips. A mould is provided for surrounding the semiconductor chips with plastic housing composition, the mould having a lower part and an upper part and a moldings cavity and the molding cavity having an upper contact area, which forms an interface with the top side of the plastic housing composition to be applied. The upper contact area is covered with a parting layer having essentially the same surface constitution and the same thermal conductivity as an adhesive film forming an interface with the underside of the plastic housing composition, with the result that a warpage of the composite board of less than 1% is obtained.

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