4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Matthew R. Walsh

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Conductive adhesive material with metallurgically-bonded...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Electronic module with form in-place pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Microwave communication package

Communications: radio wave antennas – Antennas – Microstrip
Reexamination Certificate

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Mutli-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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No-flow underfill material and underfill method for flip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2667179

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