Electronic module with form in-place pedestal

Details Electronic module with form in-place pedestal Electronic module with form in-place pedestal

2007-04-10

2007-04-10

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S778000

Reexamination Certificate

active

10919157

ABSTRACT:
An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.

REFERENCES:
patent: 4927697 (1990-05-01), Hill
patent: 6560122 (2003-05-01), Weber
patent: 6651320 (2003-11-01), Yagi et al.
patent: 2003/0189243 (2003-10-01), Jiang et al.
patent: 1519641 (2005-03-01), None

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