Microwave communication package

Details Microwave communication package Microwave communication package

2007-09-28

2010-12-21

Wimer, Michael C (Department: 2821)

Communications: radio wave antennas

Antennas

Microstrip

C333S247000, C333S248000

Reexamination Certificate

active

07855685

ABSTRACT:
A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

REFERENCES:
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patent: 5023624 (1991-06-01), Heckaman et al.
patent: 6172412 (2001-01-01), Wein et al.
patent: 6809688 (2004-10-01), Yamada
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Paul Dixon, Dampening Cavity Resonance Using Absorber Material, RF Design, May 16-18, 2004.
Paul Dixon, Dampening Cavity Resonance Using Absorber Material, May 2004, RF Design, pp. 16-19.

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