4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Masataka Watabe

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Method of forming solder film

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

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Method of forming solder film

Metal treatment – Compositions – Fluxing
Patent

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Method of forming solder film

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Solder circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Solution for selectively imparting tackiness to a metallic surfa

Compositions: coating or plastic – Coating or plastic compositions – Heavy metal compound containing
Patent

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Profile ID: LFUS-PAI-P-633474

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