Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1995-08-10
1998-05-12
Silverberg, Sam
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
174259, H05K 324
Patent
active
057502714
ABSTRACT:
A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.
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Data Base WPI, Week 9145, Derwent Publications Ltd., AN 91-329848.
Data Base WPI, Week 8218, Derwent Publications Ltd., AN 82-36159.
Kuramoto Takeo
Noda Satoshi
Sakai Takekazu
Shoji Takashi
Watabe Masataka
Showa Denko K.K.
Silverberg Sam
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