Method of forming solder film

Details Method of forming solder film Method of forming solder film

1995-08-10

1999-07-27

Ryan, Patrick

Metal treatment

Compositions

Fluxing

148 23, 148 22, B23K 3524

Patent

active

059284404

ABSTRACT:
A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

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Data Base WPI. Week 9145, Derwent Publications Ltd., AN 91-329848.
Data Base WPI. Week 9145, Derwent Publications Ltd., An 82-36159.

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