Method of forming solder film

Details Method of forming solder film Method of forming solder film

1994-10-31

1996-09-17

Bradley, P. Austin

Metal fusion bonding

Process

Preplacing solid filler

228253, 228255, 427197, 427205, B23K 120

Patent

active

055560237

ABSTRACT:
A method is available for forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts which is capable of forming a precise and fine pattern. The method comprises selectively imparting tackiness to only a predetermined part of the metallic surface by use of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

REFERENCES:
patent: 3716421 (1973-02-01), Burkhart et al.
patent: 3736653 (1973-06-01), Maierson et al.
patent: 4172547 (1979-10-01), DelGrande
patent: 4298407 (1981-11-01), Taylor
patent: 4380518 (1983-04-01), Wydro, Sr.
patent: 5110384 (1992-05-01), Dudek et al.
patent: 5114744 (1992-05-01), Cloutier et al.
Patent Abstracts of Japan, vol. 017, No. 081 (E-1321) 18 Feb. 1993.
Patent Abstracts of Japan, vol. 015, No. 191 (E-1068) 16 May 1991.
Patent Abstracts of Japan, vol. 013, No. 548 (E-856) 7 Dec. 1989.
Patent Abstracts of Japan, vol. 016, No. 158 (E-1191) 17 Apr. 1992.
Patent Abstracts of Japan, vol. 016, No. 026 (M-1202) 22 Jan. 1992.
Data Base WPI, Week 9145, Derwent Publications Ltd., AN 91-329848.
Data Base WPI, Week 8218, Derwent Publications Ltd., AN 82-36159.

Affiliated with

Also associated with

Rating

Method of forming solder film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming solder film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming solder film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-408320