4. Electrical connectors
  5. Contact terminal
  6. For functioning electrical component,

Masashi Konda

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Lead structure for packaging semiconductor chip

Electrical connectors – Contact terminal – For functioning electrical component
Patent

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Method of bonding bumps to leads of tab tape and an apparatus fo

Fishing – trapping – and vermin destroying
Patent

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Process and apparatus for forming ball bumps

Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent

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Process and apparatus for forming ball bumps

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Process and apparatus for forming ball bumps

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-558114

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