Process and apparatus for forming ball bumps

Details Process and apparatus for forming ball bumps Process and apparatus for forming ball bumps

1997-04-28

1999-01-12

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

221200, 156267, 438613, 228 41, H01L 2160, B23K 106

Patent

active

058576100

ABSTRACT:
A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

REFERENCES:
patent: 4104102 (1978-08-01), Eagon et al.
patent: 4206542 (1980-06-01), Reavill
patent: 4346516 (1982-08-01), Yokouchi et al.
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5431332 (1995-07-01), Kirby et al.

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