Lead structure for packaging semiconductor chip

Details Lead structure for packaging semiconductor chip Lead structure for packaging semiconductor chip

1991-03-14

1992-08-11

Abrams, Neil

Electrical connectors

Contact terminal

For functioning electrical component,

26427217, 361421, 357 70, 357 72, H01L 2328, H01L 23495

Patent

active

051374790

ABSTRACT:
A lead structure for packaging a semiconductor chip is provided which includes a plurality of electroconductive leads. At least one lead of an adjacent pair of electroconductive leads has at least one projecting portion which projects towards the other lead of the pair so that a tortuous path is defined between the electroconductive leads. The tortuous path minimizes outflow of molten plastic between the electroconductive leads.

REFERENCES:
patent: 3689991 (1972-09-01), Aird
patent: 4504427 (1985-03-01), Moyer

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