Fishing – trapping – and vermin destroying
Patent
1991-03-13
1992-05-19
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437209, 29845, H01U 2348
Patent
active
051148781
ABSTRACT:
A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.
REFERENCES:
patent: 5008997 (1991-04-01), Phy
National Technical Report, vol. 31 (1985), No. 3 pp. 116-124.
Electronic Parts and Materials vol. 28, No. 7 (1989) Jul., pp. 66-76.
Kikuchi Tosiharu
Konda Masashi
Maruyama Tadakatsu
Ohno Yasuhide
Otsuka Hiroaki
Chaudhuri Olik
Griffis Andrew
Nippon Steel Corporation
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