Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Integrated circuit package that has a plurality of staggered pin
Integrated circuit package with a heat spreader coupled to a pai
Integrated circuit package with a plurality of vias that are ele
Methods forming an integrated circuit package with a split...
Split cavity wall plating for an integrated circuit package
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Profile ID: LFUS-PAI-P-1378903