Integrated circuit package with a heat spreader coupled to a pai

Details Integrated circuit package with a heat spreader coupled to a pai Integrated circuit package with a heat spreader coupled to a pai

1997-02-25

1999-12-28

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257713, 361715, 361749, H05K 720

Patent

active

060089881

ABSTRACT:
A multi-chip module which contains a heat spreader that maintains a relatively uniform temperature profile between the devices of the module. The module includes a first electronic device and a second electronic device that are both mounted to a package. The devices are electrically connected by routing within the package. A heat spreader that is thermally coupled to both devices. The heat spreader transfers the heat generated by the electronic devices so that the devices operate at approximately the same temperature. A heat slug may be attached to the heat spreader to reduce the thermal impedance of the module.

REFERENCES:
patent: 4612601 (1986-09-01), Watari
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5396403 (1995-03-01), Patel
patent: 5398160 (1995-03-01), Umeda
patent: 5455382 (1995-10-01), Kojima et al.
patent: 5625227 (1997-04-01), Estes et al.

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