4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Mark Fery

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Integral solder and plated sealing cover and method of making sa

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Thermal interconnect systems methods of production and uses...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Thermal interconnect systems methods of production and uses...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1871795

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