Metal fusion bonding – Process – Preplacing solid filler
Patent
1995-07-05
1997-06-17
Heinrich, Samuel M.
Metal fusion bonding
Process
Preplacing solid filler
2282352, 228170, H01L 2150, B23K 3102
Patent
active
056390149
ABSTRACT:
A method of making an integral solder and plated cover for an electronic package is described which involves applying a corrosion resistant material onto a metal strip and a solderable material on the corrosion resistant material. A solder material is then roll clad over the solderable material after which it is stamped to covers which are then coated with gold.
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Damiano David M.
Fery Mark
Oldham Terry J.
Heinrich Samuel M.
Johnson Matthey Electronics Inc.
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