Integral solder and plated sealing cover and method of making sa

Metal fusion bonding – Process – Preplacing solid filler

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Details

2282352, 228170, H01L 2150, B23K 3102

Patent

active

056390149

ABSTRACT:
A method of making an integral solder and plated cover for an electronic package is described which involves applying a corrosion resistant material onto a metal strip and a solderable material on the corrosion resistant material. A solder material is then roll clad over the solderable material after which it is stamped to covers which are then coated with gold.

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