4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Maria Guardado

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Method for modifying a C4 semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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No clean flux for flip chip assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Organic packages having low tin solder connections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Solder reflow furnace with flux effluent collector and...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1792051

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