No clean flux for flip chip assembly

Details No clean flux for flip chip assembly No clean flux for flip chip assembly

1998-03-17

2000-08-15

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438118, H01L 2144, H01L 2148, H01L 2150

Patent

active

061035491

ABSTRACT:
A method of assembling a substrate and die in a flip chip configuration using a no clean flux. The no clean fluxes have sufficient chemical activity to activate solder bumps contacting bond pads to form reliable solder joints, sufficient tackiness to hold the substrate and die in alignment with the solder bumps contacting the bond pads, and a viscosity to enable a high volume manufacturing process to be used. The no clean fluxes leave a minimal amount of residue during a reflow process that does not interfere with an underfill operation and does not adversely affect the solder joints. The no clean fluxes that can be used for this application are RM1919 from Alpha Metals, Co. and H208 from Indium Company.

REFERENCES:
patent: 5647123 (1997-07-01), Greenwood et al.
patent: 5872051 (1999-02-01), Fallon et al.
patent: 5953814 (1999-09-01), Sozansky et al.
XP-002107287, Sep. 2,1993, USA.

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