4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Maria Cristina B. Estacio

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Flip chip MLP with conductive ink

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Flip clip attach and copper clip attach on MOSFET device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Flip clip attach and copper clip attach on MOSFET device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method for forming semiconductor device including stacked dies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for making power chip scale package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2259535

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