Flip chip MLP with conductive ink

Details Flip chip MLP with conductive ink Flip chip MLP with conductive ink

2006-02-28

2009-12-29

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23067

Reexamination Certificate

active

07638861

ABSTRACT:
The invention provides a flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a taped leadframe with a plurality of leads and a non-conducting tape placed thereon. The electrical paths are printed on the tape to connect the features of the semiconductor device to the leads and an encapsulation layer protects the package. In a second embodiment, the MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package according to each embodiment.

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S. Wolf, Silicon Processing for the VLSI Era, 1990, Lattice Press, vol. 1, 854.

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