Flex interconnect module

Details Flex interconnect module Flex interconnect module

1990-08-30

1991-11-12

Broome, Harold

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361387, 361388, 361389, 357 79, 357 81, 165185, 174 163, H05K 720

Patent

active

050652800

ABSTRACT:
An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.

REFERENCES:
patent: 4517624 (1985-05-01), Wessely
patent: 4755911 (1988-09-01), Suzuki
patent: 4914551 (1990-04-01), Anschel et al.
patent: 4954878 (1990-09-01), Fox et al.

Affiliated with

Also associated with

Rating

Flex interconnect module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flex interconnect module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flex interconnect module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1016719