4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Manuel Carmona

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Heat sink for surface-mounted semiconductor devices

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Method for mounting a chip on a base and arrangement...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Method for mounting a chip on a base and arrangement...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Microswitch with a first actuated portion and a second...

Electricity: circuit makers and breakers – Electrostrictive or electrostatic
Reexamination Certificate

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Substrate-based housing component with a semiconductor chip

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2393559

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