Method for mounting a chip on a base and arrangement...

Details Method for mounting a chip on a base and arrangement... Method for mounting a chip on a base and arrangement...

2008-05-06

2008-05-06

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S127000, C257SE21001

Reexamination Certificate

active

07368322

ABSTRACT:
An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

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