Method for mounting a chip on a base and arrangement...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S106000, C438S127000, C257SE21001

Reexamination Certificate

active

07368322

ABSTRACT:
An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

REFERENCES:
patent: 6130116 (2000-10-01), Smith et al.
patent: 6218731 (2001-04-01), Huang et al.
patent: 6300254 (2001-10-01), Raab
patent: 6558975 (2003-05-01), Sugino et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6784555 (2004-08-01), Watson
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 6960491 (2005-11-01), Lin et al.
patent: 6969914 (2005-11-01), Fuller et al.
patent: 6992380 (2006-01-01), Masumoto
patent: 7002257 (2006-02-01), Tao et al.
patent: 2002/0096751 (2002-07-01), Chen et al.
patent: 2002/0159773 (2002-10-01), Kodama et al.
patent: 2002/0171142 (2002-11-01), Kinsman
patent: 2002/0197771 (2002-12-01), Dotta et al.
patent: 2003/0160312 (2003-08-01), Lo et al.
patent: 2005/0064630 (2005-03-01), Zacherl et al.
patent: 10133361 (2003-01-01), None
patent: 102 01 204 (2003-07-01), None
patent: 60-243180 (1985-12-01), None
patent: 61-138680 (1986-06-01), None
patent: WO 01/09939 (2001-02-01), None
patent: WO 03/025080 (2003-03-01), None
patent: WO 03/025081 (2003-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for mounting a chip on a base and arrangement... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for mounting a chip on a base and arrangement..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for mounting a chip on a base and arrangement... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2781300

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.