Substrate-based housing component with a semiconductor chip

Details Substrate-based housing component with a semiconductor chip Substrate-based housing component with a semiconductor chip

2007-08-14

2007-08-14

Wilczewski, Mary (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000, C257S784000, C257S774000

Reexamination Certificate

active

11155317

ABSTRACT:
The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.

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