Heat sink for surface-mounted semiconductor devices

Details Heat sink for surface-mounted semiconductor devices Heat sink for surface-mounted semiconductor devices

2007-06-12

2007-06-12

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S704000, C165S080300, C257S713000, C257S719000, C174S016300

Reexamination Certificate

active

11118778

ABSTRACT:
A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

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The Atricle: One Piece Snap On Heat Sink. IBM Technical Disclosure Bulletine, Lune 1979, vol. # 22, Issue # 1, pp. 71-72.

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