4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With bumps on ends of lead fingers to connect to semiconductor

Manabu Bonkohara

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Capacitor built-in integrated circuit packaged unit and process

Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent

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Chip carrier semiconductor device assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Patent

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Chip carrier semiconductor device assembly and a method for form

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Device module comprising a substrate having grooves fixed to cir

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Device module comprising a substrate having grooves fixed to cir

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Profile ID: LFUS-PAI-P-559426

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