Chip carrier semiconductor device assembly and a method for form

Details Chip carrier semiconductor device assembly and a method for form Chip carrier semiconductor device assembly and a method for form

1996-09-20

1998-11-10

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438126, H01L 2160

Patent

active

058343385

ABSTRACT:
A chip carrier semiconductor device comprises a semiconductor chip having a surface on which a plurality of contact pads, a tape carrier overlying the semiconductor chip and a plurality of leads provided on the tape carrier to overly the semiconductor chip, each of the leads having an inside end being provided with at last one bump for bonding a board, the bump being positioned on an inside area of the contact pads.

REFERENCES:
patent: 5083191 (1992-01-01), Ueda
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5477611 (1995-12-01), Sweis et al.
Matthew, L., et al., "Future Directions in TAB: The TCC/MCM Interconnect", ITAP & Flip Chip Proceedings, Dec. 1994, pp. 228-231.
IBM Microelectronics, Tape Ball Grid Array (TBGA), Doc. #SPMATBSFU-03, Aug., 1993, four pages.

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