Bump bonder with a discard bonding area

Details Bump bonder with a discard bonding area Bump bonder with a discard bonding area

1997-09-24

1999-05-04

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

2281805, 228 11, B23K 3700, B23K 106

Patent

active

058993754

ABSTRACT:
The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.

REFERENCES:
patent: 4705204 (1987-11-01), Hirota et al.
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5263246 (1993-11-01), Aoki
patent: 5438020 (1995-08-01), Grancher et al.
patent: 5601740 (1997-02-01), Eldridge et al.
patent: 5813115 (1998-09-01), Misawa et al.

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