4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Lloyd G. Burrell

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Copper to aluminum interlayer interconnect using stud and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Copper to aluminum interlayer interconnect using stud and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Method of fabricating a wire bond pad with Ni/Au metallization

Semiconductor device manufacturing: process – Forming schottky junction – Using refractory group metal
Reexamination Certificate

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Methods for forming co-planar wafer-scale chip packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Methods for forming co-planar wafer-scale chip packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2266547

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