Method of fabricating a wire bond pad with Ni/Au metallization

Details Method of fabricating a wire bond pad with Ni/Au metallization Method of fabricating a wire bond pad with Ni/Au metallization

2007-11-13

2007-11-13

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Forming schottky junction

Using refractory group metal

C438S612000, C438S614000, C438S617000, C438S648000, C257S763000, C257S765000, C257S770000

Reexamination Certificate

active

10676172

ABSTRACT:
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.

REFERENCES:
patent: 4690746 (1987-09-01), McInerney et al.
patent: 4696098 (1987-09-01), Yen
patent: 5635253 (1997-06-01), Canaperi et al.
patent: 6174823 (2001-01-01), Dobson et al.
patent: 6180505 (2001-01-01), Uzoh
patent: 6239494 (2001-05-01), Besser et al.
patent: 6274935 (2001-08-01), Uzoh
patent: 6306751 (2001-10-01), Patel et al.
patent: 6350667 (2002-02-01), Chen et al.
patent: 6376353 (2002-04-01), Zhou et al.
patent: 6403457 (2002-06-01), Tandy
patent: 6451681 (2002-09-01), Greer
patent: 6548327 (2003-04-01), De Pauw et al.
patent: 6713381 (2004-03-01), Barr et al.
patent: 6733823 (2004-05-01), Lee et al.
patent: 2003/0054633 (2003-03-01), Lee et al.
patent: 2005/0032348 (2005-02-01), Farnworth et al.

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