Apparatus and method for single die backside probing of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S755090, C324S758010

Reexamination Certificate

active

07112983

ABSTRACT:
An apparatus for facilitating single die backside probing of semiconductor devices includes a chip holder configured for receiving a single integrated circuit die attached thereto, the chip holder maintained in flexible engagement in an X-Y orientation with respect to a lift plate. A lift ring is coupled to the lift plate, the lift ring configured to facilitate adjustment of the lift plate and the chip holder in a Z-direction.

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M. Mahanpour et al.; “Die and Solder Ball Defect Inspection in Flip Chipped Packaged Devices;” found at http://www.fabtech.org/features/tap/articles/06.433.html, . 9 pages, no month/year.
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