4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Liming Tsau

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Dual-damascene interconnect structures and methods of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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High density metal capacitor using dual-damascene copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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High density metal capacitor using via etch stopping layer...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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High density metal capacitor using via etch stopping layer...

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate

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High-density metal capacitor using dual-damascene copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2471656

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