4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including contaminant removal or mitigation

Li-Don Chen

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Barrier layer stack to prevent Ti diffusion

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Barrier layer stack to prevent Ti diffusion

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of assembly stress protection

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2147636

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