4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Leslie R. Fox

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Apparatus for packaging and cooling integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Integral heat pipe module

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Method of cooling and powering an integrated circuit chip using

Fishing – trapping – and vermin destroying
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Method of packaging and powering integrated circuit chips and th

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
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Profile ID: LFUS-PAI-P-28266

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