Integral heat pipe module

Details Integral heat pipe module Integral heat pipe module

1987-10-09

1989-05-23

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

16510426, 16510433, H05K 720

Patent

active

048335673

ABSTRACT:
An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface. The latent heat of vaporization is removed from the vapor so it recondenses and returns to the bottom of the module to repeat the heat transfer cycle. The wick's capillary pumping action keeps the fluid distributed over the top surface of the electronic component. The grooved top surface of the electronic component exposed to the wick cause an inverted liquid meniscus to be formed over the component. This causes the liquid adjacent the top of the component to readily evaporate.

REFERENCES:
patent: 3525670 (1970-08-01), Brown
patent: 3613778 (1971-10-01), Feldman, Jr.
patent: 3741292 (1973-06-01), Askalu et al.
patent: 3851221 (1974-11-01), Beaulieu et al.
patent: 4000776 (1977-01-01), Kreobig
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4203129 (1980-05-01), Oktay
patent: 4212349 (1980-07-01), Andros et al.
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4322737 (1982-03-01), Silwa, Jr.
patent: 4327399 (1952-04-01), Saaski
patent: 4567505 (1986-01-01), Pease
IBM-T.D.B., vol. 13, No. 5, Oct. 1970, Ing, "Self-Cooling Heat Exchanger-Condenser".
IBM-T.D.B., vol. 20, No. 7, Dec. 1977, Krumm, "Chip Cooling".
IBM-T.D.B., vol. 22, No. 3, Aug. 1979, Bakos, Hoffman, Rivenburgh, and Wang, "Programmable Heat Sink Device for Thermal Enhancement".
IBM-T.D.B., vol. 18, No. 3, Aug. 1975.
Silicon Tunnel Heat Sink, Strudwick, IBM Tech. Discl. Bulletin, vol. 23, No. 2, Jul. 1980, p. 579.
Oliver and Feldman, Investigation of Grooved Heate Pipe Evaporators Employing Vapor Release Slots, 1979, American Institute of Aeronautics and Astronautics.

Affiliated with

Also associated with

Rating

Integral heat pipe module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integral heat pipe module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integral heat pipe module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1734523