Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Contact pad and method of forming a contact pad for an...
Flip chip integrated circuit packages accommodating exposed...
Integrated circuit package and apparatus and method of...
Metal lid with improved adhesion to package substrate
Metal lid with improved adhesion to package substrate
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Profile ID: LFUS-PAI-P-2244302