Contact pad and method of forming a contact pad for an...

Details Contact pad and method of forming a contact pad for an... Contact pad and method of forming a contact pad for an...

2007-06-05

2010-10-26

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S773000, C257S786000, C257SE23021

Reexamination Certificate

active

07821132

ABSTRACT:
A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base of the contact pad; a plurality of projections extending from and substantially perpendicular to the flat portion; and a solder ball attached to the projections and the flat portion. A method of forming a contact pad is also disclosed.

REFERENCES:
patent: 5592736 (1997-01-01), Akram et al.
patent: 5686762 (1997-11-01), Langley
patent: 6291897 (2001-09-01), Wark et al.
patent: 6313541 (2001-11-01), Chan et al.
patent: 6384343 (2002-05-01), Furusawa
patent: 7170187 (2007-01-01), Bernier et al.
patent: 7394159 (2008-07-01), Goto et al.
patent: 2003/0216023 (2003-11-01), Wark et al.
patent: 2006/0192285 (2006-08-01), Kilger et al.

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