Metal lid with improved adhesion to package substrate

Details Metal lid with improved adhesion to package substrate Metal lid with improved adhesion to package substrate

2004-03-09

2008-03-11

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S666000, C257S678000, C257S704000, C257S787000, C257SE23181

Reexamination Certificate

active

07342298

ABSTRACT:
A metal lid for packaging semiconductor chips is stamped to form a sloped sidewall with a set-back from the edge of a package substrate. After the metal lid is placed over the semiconductor chip, molding compound is formed around portions of the exposed perimeter of the package substrate and against the sloped sidewall of the lid. The molding compound securely attaches the lid to the package substrate, providing improved reliability to the lid-substrate joint. The lightweight lid also increases standoff when a solder ball-grid array is used to connect the packaged IC to a printed wiring board, improving the reliability of the ball-grid array connections.

REFERENCES:
patent: 5455456 (1995-10-01), Newman
patent: 6246115 (2001-06-01), Tang et al.
patent: 6278182 (2001-08-01), Liu et al.
patent: 6433420 (2002-08-01), Yang et al.
patent: 6486564 (2002-11-01), Liu et al.
patent: 6525421 (2003-02-01), Chia et al.
patent: 6654248 (2003-11-01), Fishley et al.
Asymtek; Total Dispensing Solutions, A Newletter About Automated Fluid Dispensing; “Asymtek Equipment Enhances W.L. Gore's New Flip-Chip Packaging Program”; published by Asymtek; Spring 1998; pp.

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