4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Kyong-Mo Bang

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Components, methods and assemblies for stacked packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Components, methods and assemblies for stacked packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Methods of making microelectronic packages including folded...

Metal working – Method of mechanical manufacture – Electrical device making
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Microelectronic packages with self-aligning features

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
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Profile ID: LFUS-PAI-P-2169548

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