Microelectronic packages with self-aligning features

Details Microelectronic packages with self-aligning features Microelectronic packages with self-aligning features

2006-05-30

2006-05-30

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S797000, C257S727000, C361S749000

Reexamination Certificate

active

07053485

ABSTRACT:
A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.

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