Methods of making microelectronic packages including folded...

Details Methods of making microelectronic packages including folded... Methods of making microelectronic packages including folded...

2007-07-24

2007-07-24

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S832000, C029S834000, C029S854000, C257S776000, C257S786000, C361S749000, C361S783000, C438S118000, C438S125000

Reexamination Certificate

active

10654375

ABSTRACT:
A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.

REFERENCES:
patent: 3766439 (1973-10-01), Isaacson
patent: 3873889 (1975-03-01), Leyba
patent: 4781601 (1988-11-01), Kuhl
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5117282 (1992-05-01), Salatino
patent: 5281852 (1994-01-01), Normington
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5345205 (1994-09-01), Kornrumpf
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5397916 (1995-03-01), Normington
patent: 5448511 (1995-09-01), Pavrus et al.
patent: 5600541 (1997-02-01), Bone et al.
patent: 5646446 (1997-07-01), Nicewarner, Jr. et al.
patent: 5776797 (1998-07-01), Nicewarner, Jr. et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6111761 (2000-08-01), Peana et al.
patent: 6225688 (2001-05-01), Kim et al.
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6370932 (2002-04-01), Liu
patent: 6426240 (2002-07-01), Isaak
patent: 6441476 (2002-08-01), Emoto
patent: 6562641 (2003-05-01), Freeman
patent: 61-029140 (1986-02-01), None
“Ultra-High-Density Interconnect Flex Substrates,” HDI, Dec. 1998.

Affiliated with

Also associated with

Rating

Methods of making microelectronic packages including folded... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of making microelectronic packages including folded..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of making microelectronic packages including folded... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3744785