4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Kwong Hon Wong

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Adhesion layer for Pt on SiO 2

Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate

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Capping layer for improved silicide formation in narrow...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chromium adhesion layer for copper vias in low-k technology

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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CMP slurry additive for foreign matter detection

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate

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Conversion of amorphous layer produced during IMP Ti deposition

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1612075

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