4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Kwok Cheung Tsang

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Ball grid array package and process for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Ball grid array package and process for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Die-up tape ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Electronic components such as thin array plastic packages...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Leadless plastic chip carrier

Stock material or miscellaneous articles – Structurally defined web or sheet – Including grain – strips – or filamentary elements in...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2371517

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