4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material

Kun-Chih Wang

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Bonding pad structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Chemical plasma treatment for rounding tungsten surface spires

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate

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Deposition method with improved step coverage

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Patent

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Fuse structure integrated wire bonding on the low k...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Method fabricating metal interconnected structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Utility Patent

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Profile ID: LFUS-PAI-P-583809

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