4. Fishing, trapping, and vermin destroying

Kuang-Chih Wang

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Air gap for dual damascene applications

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Air gap for tungsten/aluminum plug applications

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Air gap formation method for reducing undesired capacitive...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Air gap structure and formation method for reducing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Al-based contact formation process using Ti glue layer to preven

Fishing – trapping – and vermin destroying
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Profile ID: LFUS-PAI-P-1565689

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