4. Coating processes
  5. Electrical product produced
  6. Integrated circuit, printed circuit, or circuit board

Krishna K. Nair

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Electronic structures including conductive shunt layers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate

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Low temperature methods of bonding components

Metal fusion bonding – Process – Diffusion type
Reexamination Certificate

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Low temperature methods of bonding components and related...

Metal fusion bonding – Process – Diffusion type
Reexamination Certificate

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Methods of forming electronic structures including...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Process for making multilayer integrated circuit substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
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Profile ID: LFUS-PAI-P-1917786

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