Methods of forming electronic structures including...

Details Methods of forming electronic structures including... Methods of forming electronic structures including...

2007-11-20

2007-11-20

Menz, Douglas M. (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000

Reexamination Certificate

active

11226569

ABSTRACT:
Methods of forming an electronic structure may include forming a seed layer on an electronic substrate, and forming a conductive shunt layer on portions of the seed layer wherein portions of the seed layer are free of the conductive shunt layer. A conductive barrier layer may be formed on the conductive shunt layer opposite the seed layer wherein the conductive shunt layer comprises a first material and wherein the barrier layer comprises a second material different than the first material. Moreover, a solder layer may be formed on the barrier layer opposite the conductive shunt layer wherein the solder layer comprises a third material different than the first and second materials. Related structures are also discussed.

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Howell et al: “Area Array Solder Interconnection Technology for the Three-Dimensional Silicon Cube

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