4. Plastic and nonmetallic article shaping or treating: processes
  5. With severing, removing material from preform mechanically,...
  6. Flash or sprue removal type

Koichi Ozaki

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Board for IC card having component mounting recess

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Hollow silicone resin particles and method for the preparation t

Plastic and nonmetallic article shaping or treating: processes – Formation of solid particulate material directly from molten... – By impinging or atomizing with gaseous jet or blast
Patent

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Hollow silicone resin particles and method for the...

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter
Reexamination Certificate

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Injection molding method for board for IC card

Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Flash or sprue removal type
Patent

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Method and apparatus for cutting high viscosity liquid material

Colloid systems and wetting agents; subcombinations thereof; pro – Continuous liquid or supercritical phase: colloid systems;... – Aqueous continuous liquid phase and discontinuous phase...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-272825

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