Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Flash or sprue removal type
Patent
1995-07-21
1998-03-10
Heitbrink, Jill L.
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Flash or sprue removal type
2643287, 264334, 425556, 425577, 425444, B29C 4538, B29C 4540
Patent
active
057258198
ABSTRACT:
A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.
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Kegai Seiji
Onishi Masayoshi
Ozaki Koichi
Takagi Hiroyoshi
Tamada Kaname
Heitbrink Jill L.
Hitachi Maxell Ltd.
Maxell Seiki, Ltd.
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