Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
1997-09-25
2001-02-20
Gaffin, Jeffrey (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S260000, C174S050510, C361S767000, C361S768000
Reexamination Certificate
active
06191366
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a board for an IC card for mounting an integrated circuit chip or the like.
2. Description of the Prior Art
An IC (integrated circuit) card comprises a board on which electronics components such as an IC chip of a memory device or a microprocessor are mounted. A board provided for producing an IC card may have one or more recesses on a plane thereof for mounting components. A board may be produced by injection molding. For example, after the components are fixed to the recess, resin is filled into the recesses to seal the components.
Such a board is described for example in Japanese Patent laid open Publication 62-298143/1987. In the production of the board, a plastic plate of a prescribed thickness is punched with a press to produce a card blank. Then, recesses for mounting components are cut in the blank precisely by a numerical control machine, to provide the board. However, the board produced as described above has a high production cost, and it is hard to reduce the cost even by mass production.
If the board is formed with injection molding with a plastics material at the same time as the recesses for mounting the components as an integral body, the production cost can be reduced largely. However, the thickness of the board is about 0.8 mm. Therefore, if the recesses are formed at the same time, the thickness at the bottom wall of the recesses becomes very thin, or the bottom walls cannot be formed surely. Therefore, cutting is adopted at present than injection molding.
However, if cutting is adopted, when an integrated circuit chip is fitted to the recess for adhesion, a portion of the recess to be adhered has a relatively smooth surface due to precise cutting. Therefore, when an IC card is subjected to a strong shock or when a card is bent, a part of adhesion plane is liable to be separated. In order to prevent the separation, the walls may be remained to have rough surfaces to increase adhesion strength. However, in such a case, precision along depth direction is liable to have a scattering, and precision of positions of connection terminals of integrated circuit chips cannot be maintained.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a manufacturing method of a board for an IC card, the board having a recess with a film-like wall at the bottom of the recess, the board made by a method being able to mass-produce the board to reduce a production a cost to a large degree.
Another object of the present invention is to provide a board for an IC card made by a method which can form a film-like wall surely without increasing injection pressure while improving mechanical strength and heat resistance.
A third object of the present invention is to provide of a board for an IC card made by a method which can form the board without strain due to forming.
A fourth object of the present invention is to provide a board for an IC card made by a method which can remove a gate during the forming so that removal of the gate after separating the mold is not needed to reduce a production cost of the board.
A fifth object of the present invention is to provide a board for an IC card, the board itself or a bottom wall thereof having a sufficient mechanical strength to improve endurance.
A sixth object of the present invention is to provide a board for an IC card having no strain due to forming, no deformation due to heat and superior on heat resistance.
A seventh object of the present invention is to provide a board for an IC card wherein a component such as an IC chip can be adhered and fixed strongly to a recess so-that the component is not removed when an abnormal strength of bending and shock exerts to the board or the endurance is good.
In one aspect of the invention, a board for an IC card is manufactured. The board has a recess for receiving a component such as an integrated circuit chip in one of the planes of the board, and the recess has a film-like wall integrated as one body with the board at an inner bottom of the recess. In the method, (a) a slide core is provided in a mold for injection molding for forming the board, the slide core
15
facing a cavity
12
in the mold. (b) Then, molten resin is injected into the cavity, and the slide core is moved into the cavity to a forming position before the resin began to solidify. Thus, the recess and the film-like wall can be formed at the same time surely.
In a second aspect of the invention, a board for an IC card, comprises a recess for receiving a component such as an integrated circuit chip in one of the planes of the board, the recess having a film-like wall integrated as one body with the board at an inner bottom of the recess. The board is made of a plastic material by using injection molding, and the recess and the film-like wall are made with a slide core projecting into a cavity with injected molten resin.
In a third aspect of the invention, a board for an IC card comprises a recess for receiving and adhering a component such as an integrated circuit chip in one of the planes of the board produced by injection molding, and the recess has a film-like wall integrated as one body with the board at an inner bottom of the recess. The board comprises an adhesion wall for adhering the component for fixing it, the adhesion wall having an uneven surface.
It is an advantage of the invention that a film-like wall at the bottom of the recess can be formed surely in a board for an IC card.
It is another advantage of the invention is that a board for an IC card can be mass-produced.
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Kegai Seiji
Onishi Masayoshi
Ozaki Koichi
Takagi Hiroyoshi
Tamada Kaname
Birch & Stewart Kolasch & Birch, LLP
Cuneo Kamand
Gaffin Jeffrey
Hitachi Maxell Ltd.
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